|
|
|
2006-9-18 |
·¦Å¾ÀÇ ½Ç½Ã°£ Åë½Å ±â´É À§ÇÑ ÀúÀâÀ½ ¸¶ÀÌÅ©·ÎÆù ¼³°è
·¦Å¾À» ½Ç½Ã°£ Åë½Å¿¡ »ç¿ëÇÏ´Â À̵éÀÌ ´Ã¾î³²¿¡ µû¶ó ·¦Å¾¿¡¼ ÃÖ°í ǰÁúÀÇ À½¼º ÀÔ·Â ¼Ö·ç¼ÇÀ» Á¦°øÇÒ Çʿ伺ÀÌ ´ëµÎµÇ°í ÀÖ´Ù. ´ÜÀÏ Ä¨ MEMS µðÁöÅÐ ¸¶ÀÌÅ©·ÎÆùÀÌ ±× ÇØ°áÃ¥ÀÌ µÉ ¼ö ÀÖ´Ù. |
|
2006-9-13 |
Ç»ÃĽýºÅÛ, ³ª³ë¿£ÅØÀ¸·Î »õÃâ¹ß
Á¤º¸º¸È£ Àü¹®¾÷ü Ç»ÃĽýºÅÛÀº ³ª³ë¿£ÅØÀ̶ó´Â À̸§À¸·Î ³ª³ë±â¼ú ºÐ¾ß¸¦ »õ·Î¿î ¼ºÀå¿øµ¿·ÂÀ¸·Î »ï°í »õ·Ó°Ô Ãâ¹ßÇÑ´Ù°í 8ÀÏ ¹àÇû´Ù. |
|
2006-9-6 |
ETRI, IT À¶ÇÕºÎǰ Æ÷·³ ¹× ½Å±â¼ú ¹ßÇ¥
ETRI´Â 6ÀÏ, ¼¿ï ¼Ò°øµ¿ ·Ôµ¥È£ÅÚ¿¡¼ ¡°IT À¶ÇÕºÎǰ ¹ßÀüÀü·« Æ÷·³ ¹× ½Å±â¼ú ¹ßǥȸ¡±¸¦ °³ÃÖÇÑ´Ù. |
|
2006-9-6 |
Hitachi Metals, 'ÃÖ¼ÒÇü' °¡¼Ó ¼¾¼ Á¦ÀÛ
Hitachi Metals»ç´Â ÃÖ±Ù¿¡ »õ·Î¿î µðÁöÅÐ Ãâ·ÂÀÇ 3Ãà °¡¼Ó °¨Áö±â¸¦ ¹ßÇ¥Çß´Ù. Å©±â°¡ 2.9 x 2.9 x 0.92 mmÀÎ H30CD °¨Áö±â´Â ¼¼°è¿¡¼ °¡Àå ÀÛ´Ù°í ÇÑ´Ù. |
|
2006-8-28 |
Á¾À̸¦ ´ëüÇÒ 'ÀüÀÚÁ¾ÀÌ' ÈÞ´ë °¡´ÉÇÑ ½Ã´ë °¡±î¿öÁ®
µð½ºÇ÷¹À̰¡ Ãß±¸ÇØ¾ß ÇÒ 3°¡Áö ¿¬±¸Å׸¶ ÁßÀÇ Çϳª·Î Á¾ÀÌ¿Í ±âÁ¸ÀÇ ¹«°Ì°í Å« °ø°£À» Á¡À¯ÇÏ´Â µð½ºÇ÷¹À̸¦ ´ëüÇÒ ¼ö ÀÖ´Â µð¹ÙÀ̽ºÀÇ °³¹ßÀÇ Çʿ伺ÀÌ ´ëµÎ µÇ¸é¼ ÀüÀÚÁ¾ÀÌ ±â¼ú¿¡ ´ëÇÑ °ü½ÉÀÌ Æø¹ßÀûÀ¸·Î Áõ°¡Çϰí ÀÖ´Ù. |
|
2006-8-21 |
CMOS¿¡ ÅëÇյǴ ´ÙÀ̾Ƹóµå MEMS
¼¼°è ù ¹øÂ°·Î CMOS Ĩ¿¡ Á÷Á¢ ÅëÇÕµÈ MEMS(microelectromechanical systems)¸¦ °³¹ßÇÏ´Â °ÍÀº ÀÌÁ¦ ¹Ì±¹ »êÇп¬ÀÇ »õ·Î¿î °øµ¿ÀÇ ¸ñÇ¥°¡ µÇ¾ú´Ù. |
|
2006-8-11 |
³ª³ë±â¼ú ÇÁ·ÎÁ§Æ® ÀÚ±Ý Á¶´Þ °¨¼Ò
Bourne Research»ç´Â 2006³â »ó¹Ý±â¿¡ MEMS¿Í ³ª³ëÅ×Å© ¾÷üµé¿¡ Á¦°øµÇ´Â º¥Ã³ ijÇÇÅРȸ»çÀÇ ÀÚ±Ý ±Ô¸ð°¡ 2005³â µ¿±â¿¡ ºñÇØ 15.4 ÆÛ¼¾Æ® °¨¼ÒÇß´Ù°í ¹àÇû´Ù. |
|
2006-8-3 |
ÀÇ·á¿ë MEMS ¾÷ü, ASIC Á¦Á¶»ç·Î AMI ¼±ÅÃ
Sphere Medical Holding»ç°¡ AMI Semiconductor»ç¸¦ ASIC(application specific integrated circuit)ÀÇ Á¦Á¶»ç·Î ¼±Á¤Çß´Ù°í ¸»Çß´Ù. |
|
2006-7-26 |
Vistec, »õ·Î¿î ÀüÀÚºö ½Ä°¢ Åø ¹ßÇ¥
ÀÌÀü¿¡ Leica Microsystems Lithography»ç¶ó´Â ¸íĪÀ» °¡Á³´ø Vistec Lithography»ç´Â ÀÌ¹Ì ÀÚ»çÀÇ ÃʰíÇØ»óµµ Vectorbeam °è¿ÀÇ ÈÄ¼Ó Á¦Ç°ÀÎ »õ·Î¿î VB300 ÀüÀÚºö ½Ä°¢ Åø¿¡ ´ëÇÑ ÁÖ¹®À» ¹Þ¾Ò´Ù°í ¹ßÇ¥Çß´Ù. |
|
2006-7-26 |
ÆÄÀÌÄÄ, ÆÄÁÖ ¼±À¯Áö±¸¿¡ Á¦2°øÀå Ãß°¡ °Ç¼³
¹ÝµµÃ¼ ¹× LCD °Ë»ç°ü·Ã¾÷ü ÆÄÀÌÄÄÀº Áö³ 21ÀÏ ¸â½º(MEMS)±â¼úÀÇ ±Û·Î¹ú ±â¾÷À¸·Î µµ¾àÇϱâ À§ÇØ °æ±âµµ ÆÄÁÖ ¼±À¯Áö±¸ ³»¿¡ Á¦2°øÀåÀ» Ãß°¡ °Ç¸³Çϱâ·Î Çß´Ù°í ¹àÇû´Ù. |
|
2006-6-27 |
Çѱ¹ ¹ý¿ø, FormFactor»ç ƯÇã ÀÎÁ¤
¿þÀÌÆÛ Å½Ä§ °ø±ÞÀÚÀÎ FormFactor»ç´Â Çѱ¹Æ¯Çã¹ý¿øÀÌ Çѱ¹ÀÇ ½ÃÇè ȸ»çÀÎ Phicom»ç¿Í °è¼ÓÀûÀÎ ¹ýÀû ´ÙÅù¿¡¼ ¸í¹éÇÑ ½Â¸®ÀÎ ÀÚ»çÀÇ Çѱ¹Æ¯Çã Á¦252,457È£ÀÇ Å¸´ç¼ºÀ» ÀÎÁ¤ÇÏ´Â ±¸µÎ ÆÇÁ¤À» ³»·È´Ù°í ¹ßÇ¥Çß´Ù. |
|
2006-6-5 |
ºÎ°¢µÇ´Â ¹«¼±ÀÎÁö ±â¼úÀÇ Á߿伺
SDR Æ÷·³À» ÅëÇØ Á߿伺ÀÌ ºÎ°¢µÇ°í ÀÖ´Â ¹«¼±ÀÎÁö ±â¼úÀÇ °³¹ßÀ» À§ÇÑ ´Ù¾çÇÑ Á¢±Ù ³ë·ÂÀÌ ÇöÀç °¢°è¿¡¼ ÀÌ·ç¾îÁö°í ÀÖ´Ù. |
|
2006-6-5 |
FlipChip, Engent»ç¿Í 3D ¿þÀÌÆÛ ´Ü°è CSP ±â¼ú °³¹ß Á¦ÈÞ
FlipChip International»ç¿Í Engent»ç´Â ÀûÃþ½Ä ´ÙÀÌ ÆÐŰ¡ Á¦Ç°À» À§ÇØ 3D ¿þÀÌÆÛ ´Ü°è CSP ±â¼úÀÇ °³¹ß°ú Àü°³¸¦ °¡¼ÓÇϱâ À§ÇØ Á¦ÈÞÇß´Ù°í ¹ßÇ¥Çß´Ù. |
|
2006-5-29 |
MEMS, ¸ð¹ÙÀÏ ÆùÀ¸·Î »ç¿ë ¿µ¿ª ³ÐÇô
ÈÞ´ëÀüÈ ´Ü¸»±âÀÇ MEMS(microelectromechanical systems) »ç¿ëÀº Áö³ 2005 1¾ï 5,700¸¸ ´Þ·¯ ±Ô¸ð¿¡ ´Ù´Ù¶úÀ¸¸ç, 2010³â¿¡´Â 10¾ï ´Þ·¯¸¦ ÃʰúÇÒ Àü¸ÁÀ̶ó°í ½ÃÀå Á¶»ç¾÷üÀÎ In-Stat»ç°¡ ¸»Çß´Ù. |
|
2006-5-19 |
STMicro, ´ÑÅÙµµÀÇ Wii¿Í ÇÔ²² °ÔÀÓ±âÀÇ Çõ¸í ÁÖµµ
STMicroelectronics»ç´Â ÀÚ»çÀÇ 3Ãà °¡¼Ó ¼¾¼°¡ ¸ð¼ÇÀ¸·Î °¨ÁöµÇ´Â »ç¿ëÀÚ ÀÎÅÍÆäÀ̽º¸¦ Á¦°øÇÒ ¼ö ÀÖµµ·Ï ´ÑÅÙµµ (Nintendo)ÀÇ Â÷±â Ȩ ÄÜ¼Ö Wii¿¡ äÅÃµÈ´Ù°í ¹ßÇ¥Çß´Ù. |
 |
| --- ÃÑ 228 ±â»ç, ÃÑ16 ÆäÀÌÁö,ÇöÀç 9 ÆäÀÌÁö --- |
|