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2004-02-27 |
Olympus, ±¤ÇÐÁ¦Ç° ÀÓ°¡°ø »ç¾÷ °³½Ã Olympus»ç´Â Olympus Partnership Development Group(PDG)ÀÇ Optical Foundry Services¸¦ °³½ÃÇß´Ù. ÀÌ ±¤ÇÐÁ¦Ç° ÀÓ°¡°ø¿¡´Â Olympus»çÀÇ ºñ±¸¸é ·»Áî R&D¿Í ¿ÏÁ¦Ç° ¹× ±¤¼¶À¯ Åë½Å»ê¾÷¿ë Á¦Ç°ÀÌ Æ÷ÇԵȴÙ.
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2004-02-26 |
STMicro, ÃʼÒÇü Æ®¸®Çà ¹êµå GSM/GPRS Æ®·£½Ã¹ö ¸ðµâ Ãâ½Ã STMicroelectronics»ç´Â ½Ç¸®ÄÜ-°Ô¸£¸¶´½ ¹«¼± Á֯ļö BiCMOS¿Í IPAD (Integrated Passive & Active Device) ±â¼úÀ» Àû¿ë½ÃŲ Æ®¸®Çà ¹êµå GSM/GPRS Æ®·£½Ã¹ö ¸ðµâÀ» ¹ßÇ¥Çß´Ù.
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2004-02-26 |
STMicro, ÈÞ´ë¿ë ´Ü¸»±â ÀÀ¿ëÁ¦Ç° ´ë»óÀÇ 3Ãà MEMS ±â¹Ý °¡¼Óµµ°è Ãâ½Ã STMicroelectronics»ç´Â ´ÜÀÏ ÆÐŰÁö³»¿¡¼ 3Ãà ¼¾½º¿Í µðÁöÅÐ Ãâ·Â ¸ðµÎ¸¦ Á¦ÇÏ´Â MEMS ±â¹Ý 3Ãà °¡¼Óµµ°è µð¹ÙÀ̽º¸¦ Ãâ½ÃÇß´Ù°í ¹ßÇ¥Çß´Ù.
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2004-02-26 |
Microbridge, X-FAB»ç¸¦ ÀÓ°¡°ø Çù·Â¾÷ü·Î ¼±Á¤ ÀüÀÚ±â±â, ÃʼÒÇü ÀåÄ¡ ¹× ¼¾¼ ±â¹ÝÀÇ ÃʼÒÇü ½Ã½ºÅÛ ±â¼ú Àü¹®È¸»çÀÎ Microbridge Technologies»ç´Â µ¶ÀÏÀÇ X-FAB Semiconductor Foundries»ç¸¦ ÀÓ°¡°ø Çù·Â¾÷ü·Î ¼±Á¤Çß´Ù.
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2004-02-20 |
STMicro °¡¼Óµµ°è, Á÷·Ä µðÁöÅÐ Ãâ·Â Á¦°ø STMicroelectronics´Â ´ÜÀÏ ÆÐŰÁö·Î 3Ãà °¨Áö¿Í µðÁöÅÐ Ãâ·ÂÀ» Á¦°øÇÏ´Â MEMS ±â¹ÝÀÇ 3Ãà °¡¼Óµµ°è ÀåÄ¡ÀÇ °ßº»À» Ãâ½ÃÇÑ´Ù°í ¹ßÇ¥Çß´Ù.
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2004-02-13 |
ȼº Ž»ç¼±ÀÇ Camera IC, Tanner»çÀÇ EDA ±â¼ú·Î ¼³°è Tanner Research»çÀÇ ÀÚȸ»çÀÎ Tanner EDA»ç¿¡¼´Â ÀÚ»çÀÇ ¼ÒÇÁÆ®¿þ¾î·Î ¼³°èµÈ ¹ÝµµÃ¼ Á÷Á¢ ȸ·Î°¡ ¹Ì¿¬¹æ ¿ìÁÖ Ç×°ø±¹(NASA)ÀÇ È¼º Ž»ç¼±ÀÎ 'Opportunity'¿Í 'Spirit'ÀÇ Ä«¸Þ¶ó¿¡ ÀåÂøµÇ¾î ¼º°øÀûÀ¸·Î ÀÛµ¿Çϰí ÀÖ´Ù°í ¹ßÇ¥Çß´Ù.
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2004-01-19 |
IMS, Â÷·®¿ë ¼¾¼ ±â¼ú Áö¼ÓÀûÀ¸·Î ¼ºÀå ¿¹Ãø IMS Research»ç´Â "Àü¼¼°è ÀÚµ¿Â÷ ¼¾¼ ½ÃÀå"À̶ó´Â ÃֽŠº¸°í¼¿¡¼ ÀÚµ¿Â÷ ¼¾¼ ±â¼úÀº ÇâÈÄ 10³â°£ °è¼ÓÇØ¼ ¼ºÀåÇÒ °ÍÀ¸·Î ¿¹»óÇß´Ù.
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2004-01-05 |
Á¤º¸ ¼Õ½Ç ¹æÁöÇÏ´Â ADIÀÇ MEMS °¡¼Óµµ ¼¾¼ ADI»ç´Â Active Protection System ±â¼úÀ» Ư¡À¸·Î ÇÏ´Â IBM»çÀÇ ThinkPad ¸ð¹ÙÀÏ ÄÄÇ»ÅÍ ¸ÖƼ Ç÷§Æû¿¡ »ç¿ëµÉ iMEMS °¡¼Óµµ ¼¾¼ ±â¼úÀ» ¹ßÇ¥Çß´Ù.
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2003-11-20 |
Ultratech, Infotonics ¼¾ÅÍ¿¡¼ ´Ù¼ö Àåºñ ¼öÁÖ Ultratech»ç´Â ´º¿åÁÖÀÇ Center of Excellence in Photonics and Microsystems¸¦ ¿î¿µÇϱâ À§ÇØ 2001³â¿¡ ¼³¸³µÈ ºñ¿µ¸® ´ÜüÀÎ Infotonics Technology Center·ÎºÎÅÍ ÀÚ»çÀÇ NanoTech 160 ¾çÂÊ ¹è¿ (DSA) ½ºÅ×ÆÛ¿Í Ãà¼Ò ½ºÅ×ÆÛ¿¡ ´ëÇÑ ÁÖ¹®À» ¹Þ¾Ò´Ù.
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2003-11-20 |
EV Group, DALSA»çÀÇ Àü·«Àû °ø±ÞÀÚ·Î ¼±Á¤ MEMS, ³ª³ë¿Í ¹ÝµµÃ¼ ¿þÀÌÆÛ °¡°ø Àåºñ Á¦Á¶ÀÚÀÎ EV Group(EVG)»ç´Â DALSA Semiconductor»çÀÇ MEMS ¿þÀÌÆÛ °áÂø°ú µÎ²¨¿î ÁßÇÕü ½Ä°¢ ¹ÝµµÃ¼ »ý»êÀåºñ¿¡ ´ëÇÑ Àü·«Àû °ø±ÞÀÚ·Î ¼±Á¤µÇ¾ú´Ù.
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2003-11-18 |
Keithley, Zyvex»ç¿Í ÆÇ¸ÅÇù·ÂÇùÁ¤ ü°á Keithley Instruments»ç¿Í Zyvex»ç´Â ³ª³ëÅ×Å© ½ÃÀåÀ» À§ÇÑ »õ·Î¿î ¼Ö·ç¼ÇÀ» °³¹ßÇϱâ À§ÇÑ Çù·ÂÇùÁ¤À» ü°áÇß´Ù.
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2003-11-17 |
STMicroelectronics, MobiDiag»ç¿Í ÇÔ²² ºÐÀÚ Áø´Ü¿ë ¹ÙÀÌ¿ÀĨ °³¹ßÇϱâ·Î STMicroelectronics»ç´Â MobiDiag»ç¿Í ÇÔ²² 17ÀÏ ½Ç¸®ÄÜ MEMS (Micro Electro Mechanical Systems) ¹ÙÀÌ¿ÀĨ ±â¹Ý Àü¿°º´ °Ô³ð ±â¹Ý °ËÃâ¿ë ½Ã½ºÅÛÀ» °³¹ßÇϱâ·Î ÇÏ¿´´Ù.
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2003-11-14 |
Information Network, MEMS ¸¶ÀÌÅ©·ÎÆùÀÇ ³ôÀº ¼ºÀå ¿¹Ãø The Information Network»ç°¡ ÃÖ±Ù¿¡ ¹ßÇ¥ÇÑ " ¸¶ÀÌÅ©, ½ºÇÇÄ¿, ÄÚµ¦, ±×¸®°í ÃÖÁ¾ Àû¿ëºÐ¾ßµî À½ÇâÁ¦Ç°¿¡ ´ëÇÑ ½ÃÀå ºÐ¼®" º¸°í¼¿¡ µû¸£¸é MEMS ±â¼úÀº 2003³â¿¡ 12¾ï°³°¡ ÆÈ·Á¼ 1 ÆÛ¼¾Æ® ¹Ì¸¸ÀÇ ¼ºÀåÀ» ±â·ÏÇÑ ¸¶ÀÌÅ©·ÎÆù
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2003-11-11 |
STMicro, MobiDiag»ç¿Í ¹ÙÀÌ¿ÀĨ °³¹ß ÇùÁ¤ ü°á STMicroelectronics»ç´Â MobiDiag»ç¿Í ½Ç¸®ÄÜ MEMS ¹ÙÀÌ¿ÀĨÀ» ¹ÙÅÁÀ¸·Î ÇÏ¿© Àü¿°º´ÀÇ °Ô³ð ±â¹Ý °ËÃâÀ» À§ÇÑ ¿Ïº®ÇÑ ½Ã½ºÅÛÀ» »ý¼ºÇÒ °øµ¿°³¹ßÇùÁ¤À» ü°áÇß´Ù.
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2003-11-03 |
Á¤ÅëºÎ, IT ÇٽɺÎǰ »ê¾÷¿¡ 4,080¾ï¿ø ÅõÀÚÇϱâ·Î Á¤º¸Åë½ÅºÎ´Â Áö³ 31ÀÏ Á¶¼±È£ÅÚ¿¡¼ ¾à 300¸íÀÇ ¾÷°è °ü°èÀÚ, Çаè Àü¹®°¡ µîÀÌ Âü¼®ÇÑ °¡¿îµ¥ `IT ÇٽɺÎǰ À°¼ºÀü·« °øÃ»È¸`¸¦ °³ÃÖÇÏ¿© ¿À´Â 2007³â±îÁö 4,080¾ï¿øÀ» ITÇٽɺÎǰ »ê¾÷À» À°¼º½Ã۴µ¥ ÅõÀÚÇϱâ·Î Çß´Ù.
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